Title:
【発明の名称】半導体素子の実装方法
Document Type and Number:
Japanese Patent JP3336048
Kind Code:
B2
Inventors:
Mitsuo Miyazaki
Hidetaka Sonohata
Hidetaka Sonohata
Application Number:
JP31842792A
Publication Date:
October 21, 2002
Filing Date:
November 27, 1992
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP61242097A | ||||
| JP5358764A | ||||
| JP6112268A | ||||
| JP2122531A |