【発明の名称】ガラス被覆半導体装置及びその製造方法

Title:

【発明の名称】ガラス被覆半導体装置及びその製造方法

Document Type and Number:

Japanese Patent JP3339549

Kind Code:

B2

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Inventors:

Susumu Murakami
Yukio Tsuruoka
Hitoshi Matsuzaki
Minoru Sugano

Application Number:

JP27094196A

Publication Date:

October 28, 2002

Filing Date:

October 14, 1996

Export Citation:

Assignee:

株式会社日立製作所
日立原町電子工業株式会社

International Classes:

H01L21/316; H01L29/861; (IPC1-7): H01L21/316; H01L29/861

Domestic Patent References:

Attorney, Agent or Firm:

Kiyoshi Maruyama (5 others)

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