Title:
【発明の名称】金属回路を有するセラミックス回路基板の製造方法
Document Type and Number:
Japanese Patent JP3342797
Kind Code:
B2
Inventors:
Yoshihiko Tsujimura
Miyuki Nakamura
Yasuhito Fushii
Hiroto Horiuchi
Miyuki Nakamura
Yasuhito Fushii
Hiroto Horiuchi
Application Number:
JP4514696A
Publication Date:
November 11, 2002
Filing Date:
March 01, 1996
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
H05K3/00; H05K3/22; H05K1/02; H05K1/03; (IPC1-7): H05K3/22; H05K3/00
Domestic Patent References:
| JP63254031A | ||||
| JP56163093A | ||||
| JP61225047A | ||||
| JP6164081A | ||||
| JP3250688A |