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Patent Searching and Data


Title:
【発明の名称】金属回路を有するセラミックス回路基板の製造方法
Document Type and Number:
Japanese Patent JP3342797
Kind Code:
B2
Inventors:
Yoshihiko Tsujimura
Miyuki Nakamura
Yasuhito Fushii
Hiroto Horiuchi
Application Number:
JP4514696A
Publication Date:
November 11, 2002
Filing Date:
March 01, 1996
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
H05K3/00; H05K3/22; H05K1/02; H05K1/03; (IPC1-7): H05K3/22; H05K3/00
Domestic Patent References:
JP63254031A
JP56163093A
JP61225047A
JP6164081A
JP3250688A