Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP3351440
Kind Code:
B2
More Like This:
| WO/1999/013512 | SEMICONDUCTOR COMPONENT WITH A DRIFT ZONE |
| JP2003030266 | METHOD FOR SETTING WIRING PATH OF SEMICONDUCTOR INTEGRATED CIRCUIT |
| JP2000195962 | SEMICONDUCTOR DEVICE AND TRIMMING METHOD |
Inventors:
Osamu Nakayama
Application Number:
JP18416093A
Publication Date:
November 25, 2002
Filing Date:
July 26, 1993
Export Citation:
Assignee:
Kawasaki Microelectronics Co., Ltd.
International Classes:
H01L21/82; H01L21/822; H01L21/8234; H01L27/04; H01L27/088; (IPC1-7): H01L21/822; H01L21/82; H01L21/8234; H01L27/04; H01L27/088
Domestic Patent References:
| JP62285443A | ||||
| JP5175432A | ||||
| JP1298759A | ||||
| JP61176146A |
Attorney, Agent or Firm:
Yoshiki Hasegawa (3 outside)