Title:
【発明の名称】半導体昇圧回路
Document Type and Number:
Japanese Patent JP3354713
Kind Code:
B2
Inventors:
Kikuzo Sawada
Application Number:
JP14111394A
Publication Date:
December 09, 2002
Filing Date:
May 31, 1994
Export Citation:
Assignee:
Nippon Steel Corporation
International Classes:
G11C17/00; G11C16/06; H01L21/822; H01L27/04; H02M3/07; (IPC1-7): H02M3/07; H01L21/822; H01L27/04
Domestic Patent References:
| JP246162A | ||||
| JP7298606A |
Attorney, Agent or Firm:
Koetsu Kokubun