Title:
【発明の名称】化合物半導体素子
Document Type and Number:
Japanese Patent JP3357724
Kind Code:
B2
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Inventors:
Morio Wada
Application Number:
JP23311893A
Publication Date:
December 16, 2002
Filing Date:
September 20, 1993
Export Citation:
Assignee:
Yokogawa Electric Corporation
International Classes:
H01L29/43; H01L21/28; (IPC1-7): H01L29/43; H01L21/28
Domestic Patent References:
| JP62183176A | ||||
| JP62229972A | ||||
| JP6457663A |