Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP3362729
Kind Code:
B2
More Like This:
Inventors:
Ken Sakata
Kiyoo Ito
Masashi Horiguchi
Kiyoo Ito
Masashi Horiguchi
Application Number:
JP2000163139A
Publication Date:
January 07, 2003
Filing Date:
May 29, 2000
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
G11C17/18; G11C11/401; G11C11/407; G11C11/409; G11C11/418; G11C11/419; (IPC1-7): G11C11/407; G11C11/409; G11C11/418; G11C11/419
Domestic Patent References:
| JP629834A | ||||
| JP3276673A | ||||
| JP341695A | ||||
| JP5210976A | ||||
| JP6048525A | ||||
| JP63120522A |
Attorney, Agent or Firm:
Yasuo Sakuta