Title:
【発明の名称】ろう材による接合方法及び装置
Document Type and Number:
Japanese Patent JP3365511
Kind Code:
B2
Abstract:
High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.
Inventors:
Yoshiaki Mori
Takuya Miyakawa
Yasuhiko Asano
Osamu Kurashina
Satoshi Miyamori
Youhei Kurashima
Makoto Anan
Takuya Miyakawa
Yasuhiko Asano
Osamu Kurashina
Satoshi Miyamori
Youhei Kurashima
Makoto Anan
Application Number:
JP52193094A
Publication Date:
January 14, 2003
Filing Date:
April 05, 1994
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B23K1/20; B23K1/012; C23G5/00; H05K3/34; B23K101/42; (IPC1-7): B23K1/20; H05K3/34
Domestic Patent References:
| JP6210445A | ||||
| JP3174972A |
Attorney, Agent or Firm:
Akihiko Umeda