Title:
【発明の名称】封止用樹脂組成物及び半導体装置
Document Type and Number:
Japanese Patent JP3377408
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain excellent tight adhesion between a sealing resin and a lead frame, control the occurrence of peeling, and reduce the occurrence of package crack after moisture absorption and reflowing by incorporating a specified amount of a water-insoluble compound having a benzotriazole skeleton into a sealing resin composition. SOLUTION: At least a part of water-insoluble compound used comprises 1,2,3-benzotriazole represented by formula I. Water-insoluble compounds are defined as those having a solubility in water at ordinary temperature of at most about 5%, which are added in an amount of 0.01-1 wt.% based on the total composition. A biphenyl epoxy resin represented by formula II (wherein R1 to R4 are each H or methyl) is used as at least a part of epoxy resins. The curing agent used comprises a polybasic phenol compound such as phenolic novolak, or a naphthol compound. The equivalent ratio of curing agent to epoxy resin is preferably (0.5 to 1.5):1. The inorganic filler used comprises, e.g. fused silica, which is blended in an amount of preferably 70-92 wt.%.
Inventors:
Takayuki Tsuji
Masashi Nakamura
Masashi Nakamura
Application Number:
JP18996997A
Publication Date:
February 17, 2003
Filing Date:
July 15, 1997
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
B29C45/02; B29C45/14; C08G59/50; C08K3/00; C08K5/3492; C08L63/00; H01L21/56; H01L23/29; H01L23/31; B29K63/00; B29L31/34; (IPC1-7): C08L63/00; C08G59/50; C08K3/00; C08K5/3492; H01L23/29; H01L23/31
Domestic Patent References:
| JP58198525A | ||||
| JP1294765A | ||||
| JP7242731A | ||||
| JP61272228A | ||||
| JP841290A | ||||
| JP8259666A | ||||
| JP10298266A | ||||
| JP10130374A |
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)