Title:
【発明の名称】ワイヤボンディングにおけるカメラオフセットの調整方法
Document Type and Number:
Japanese Patent JP3379392
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To accurately detect position deviation of a bonding point on a miniaturized pad. SOLUTION: The relative position relation between a camera and a capillary tool is previously obtained as offset. While a capillary tool is horizontally moved in the X direction and the Y direction, pads of a substrate are connected in succession with pads of a chip by using wires 7. Wire bonding operation is temporarily interrupted, a bonding point is observed with a camera, and the image is displayed on the screen of a monitor TV. The bonding point as an observation object is magnified and displayed. By moving the camera horizontally, a reference part (the intersection of cross lines 9a, 9b) A is made to coincide with the center of a ball 7a. The movement amounts xa, ya are registered, as correction values of an offset value, in a storage device. Wire bonding is performed by horizontally moving the capillary tool on the basis of the corrected offset value.
Inventors:
Takayuki Yoshiyama
Application Number:
JP18201797A
Publication Date:
February 24, 2003
Filing Date:
July 08, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP9115943A | ||||
| JP6295328A | ||||
| JP61119054A | ||||
| JP3217039A | ||||
| JP4179133A | ||||
| JP220333U |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)