Title:
【発明の名称】半導体ウェーハのプロセス装置
Document Type and Number:
Japanese Patent JP3403207
Kind Code:
B2
Abstract:
Device for processing semiconductor wafers, comprising at least one processing chamber which is completely closed with the exception of a connection to a distribution. System. In said at least one processing chamber there are situated preferably two reactors and a common feed/removal system in order to be able to subject wafers, which may optionally be arranged in boats, to an identical processing operation.
Inventors:
Grunnemann, Ernst Hendrik August
Hasper, Albert
Zinger, Jiyang
Hasper, Albert
Zinger, Jiyang
Application Number:
JP53334298A
Publication Date:
May 06, 2003
Filing Date:
January 27, 1998
Export Citation:
Assignee:
IS M International NV
International Classes:
H01L21/302; B65G49/07; H01L21/205; H01L21/31; H01L21/324; H01L21/677; (IPC1-7): H01L21/68; H01L21/205; H01L21/3065; H01L21/31; H01L21/324
Domestic Patent References:
| JP8250571A | ||||
| JP9260246A | ||||
| JP621197A | ||||
| JP6236854A | ||||
| JP6338322U |
Attorney, Agent or Firm:
Heikichi Odashima