Title:
チップ型電子部品
Document Type and Number:
Japanese Patent JP3549653
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily mount a cylindrical aluminum electrolytic capacitor on a printed wiring board. SOLUTION: Projections 17 formed on the internal surfaces of the upper ends of pawls 16 extended from an insulating plate 14 which is brought into contact with the end face of a cylindrical aluminum electrolytic capacitor 10 are put in an annular recessed groove 5 formed on the peripheral surface of the capacitor 10 and slits 15 are provided in the insulating plate 14 in accordance with the lead wires 4a and 4b of the capacitor 10. The lead wires 4a and 4a are bent so that the wires 4a and 4a can be extended in the slits 15 and the external side faces of the wires 4a and 4a can nearly be flush with the external surface of the insulating plate 14.
Inventors:
Takeshi Nonoguchi
Izumi Fujima
Izumi Fujima
Application Number:
JP33801795A
Publication Date:
August 04, 2004
Filing Date:
December 01, 1995
Export Citation:
Assignee:
Nichicon Co., Ltd.
International Classes:
H01G9/00; H01G9/004; H01G9/10; H05K1/18; H01G2/06; H05K3/30; H05K3/34; (IPC1-7): H01G9/004; H01G2/06; H01G9/00; H01G9/10; H05K1/18
Domestic Patent References:
| JP62078738U | ||||
| JP62089124U | ||||
| JP61004421U |
Attorney, Agent or Firm:
Hiroshi Tanaka