半導体装置の製造方法 - Matsushita Electric Industrial Co., Ltd

Title:

半導体装置の製造方法

Document Type and Number:

Japanese Patent JP3552660

Kind Code:

B2

More Like This:

WO/2015/079871	HOLLOW-SPACE-SEALING RESIN SHEET AND METHOD FOR MANUFACTURING HOLLOW PACKAGE
JP2023168651	COPPER-ZINC ALLOY ELECTROPLATING SOLUTION, FORMATION METHOD OF COPPER-ZINC ALLOY BUMP, FORMATION METHOD OF NANOPOROUS COPPER BUMP, SUBSTRATE WITH COPPER-ZINC ALLOY BUMP, AND SUBSTRATE WITH NANOPOROUS COPPER BUMP
WO/2011/132670	WIRE BONDING METHOD FOR POWER SEMICONDUCTOR DEVICE

Inventors:

Tadahiko Sakai

Application Number:

JP2000314870A

Publication Date:

August 11, 2004

Filing Date:

October 16, 2000

Export Citation:

Assignee:

Matsushita Electric Industrial Co., Ltd

International Classes:

H01L21/60; H01L21/56; (IPC1-7): H01L21/60

Domestic Patent References:

Foreign References:

WO1998030073A1

Attorney, Agent or Firm:

Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito

Previous Patent: 引裂き性を改良した包装用ラッピングフィルム

Next Patent: 弾球遊技機