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Title:
マイクロレンズ金型又は金型マスター、及びそれらの作製方法
Document Type and Number:
Japanese Patent JP3554228
Kind Code:
B2
Abstract:
A mold for a microlens includes a substrate (1, 11, 31, 51, 61) at least a portion of which is electrically conductive, such as an electrically-conductive substrate or a substrate with an electrode layer (2, 12, 32, 52), an insulating mask layer (3, 13, 33, 53) formed on the substrate and including an opening or plural openings (4, 14, 34, 54), and a plated layer (5, 15, 35, 55) electroplated in the opening and on the mask layer. A first condition that a diameter or width ( DIAMETER ) of the opening (4, 14, 34, 54) has a relation of DIAMETER

Inventors:
Takayuki Yagi
Takayuki Teshima
Takashi Ushijima
Yasuhiro Shimada
Application Number:
JP20239699A
Publication Date:
August 18, 2004
Filing Date:
July 16, 1999
Export Citation:
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Assignee:
Canon Inc
International Classes:
B29C33/38; B29C33/42; B29D11/00; B29C33/00; G02B1/04; G02B3/00; B29L11/00; (IPC1-7): B29C33/38; G02B3/00
Domestic Patent References:
JP8258051A
JP6027302A
JP6194502A
JP61067526A
JP10148644A
JP5220751A
JP11320572A
JP7323428A
Attorney, Agent or Firm:
Kazuo Kato