Title:
チップオンフィルム用テープおよび半導体装置
Document Type and Number:
Japanese Patent JP3554533
Kind Code:
B2
Abstract:
A dummy pattern for preventing generation of air bubbles in resin sealing of a semiconductor element is provided at a corner of the semiconductor element on a tape carrier which is composed of a polyimide-based insulating tape and a copper foil pattern formed thereon. The dummy pattern makes it possible to control flow of sealing resin from the corner of the semiconductor element to a space between a lower surface of the semiconductor element and the insulating tape, resulting in prevention of air bubbles generated in resin sealing of the semiconductor element. A generation rate of air bubble can be decreased to 50% or less as compared with a conventional COF semiconductor device.
Inventors:
Toshiharu Seko
Application Number:
JP2000313485A
Publication Date:
August 18, 2004
Filing Date:
October 13, 2000
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L23/12; H01L21/56; H01L21/60; H01L23/48; H01L23/498; (IPC1-7): H01L21/56; H01L21/60; H01L23/12
Domestic Patent References:
| JP3020444U | ||||
| JP9181127A | ||||
| JP10012770A | ||||
| JP2000021935A |
Foreign References:
| WO2000002244A1 |
Attorney, Agent or Firm:
Aoyama Aoi
Hiroshi Yamazaki
Hiroshi Yamazaki