Title:
電子部品実装装置及び方法
Document Type and Number:
Japanese Patent JP3574666
Kind Code:
B2
Abstract:
In a component mounting apparatus, a component (8) is held, positioned and mounted at a predetermined position of a member (4) to be mounted. After the component (8) is mounted to the member (4), a component holding member (5) is raised by a distance corresponding approximately to a push-in amount by which the component holding member (5) has been moved down to mount the component, then stopped to retain the component (8), is kept in this state while retaining the component for a fixed time, and is raised again to a predetermined position.
Inventors:
Tomoyuki Nakano
Naoto Mimura
Hiroshi Ohara
Hiroshi Uchiyama
Naoto Mimura
Hiroshi Ohara
Hiroshi Uchiyama
Application Number:
JP52347098A
Publication Date:
October 06, 2004
Filing Date:
November 19, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Domestic Patent References:
| JPH07303000A | 1995-11-14 | |||
| JPH06137969A | 1994-05-20 | |||
| JPH05304395A | 1993-11-16 | |||
| JPS63150186A | 1988-06-22 |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Mitsuo Wada
Osamu Kawamiya
Mitsuo Wada