Title:
半導体ダイの実装構造
Document Type and Number:
Japanese Patent JP3583382
Kind Code:
B2
Abstract:
An SO-8 type package contains a control MOSFET die mounted on one lead frame section and a synchronous rectifier die comprising a synchronous MOSFET and Schottky diode die is mounted on a second lead frame pad section. The die are interconnected through the lead frame pads and wire bonds to define a buck converter circuit and the die and lead frame pads are overmolded with a common insulation housing.
Inventors:
Chuan Chair
Naresh Tapper
Slini Sylven Katachari
Naresh Tapper
Slini Sylven Katachari
Application Number:
JP2001155346A
Publication Date:
November 04, 2004
Filing Date:
May 24, 2001
Export Citation:
Assignee:
INTERNATIONAL RECTIFIER CORPORATION
International Classes:
H01L25/07; H01L23/34; H01L23/495; H01L25/18; (IPC1-7): H01L25/07; H01L25/18
Domestic Patent References:
| JP8070092A | ||||
| JP7058277A | ||||
| JP10150140A |
Attorney, Agent or Firm:
Aoyama Aoi
Osamu Kawamiya
Masahiro Ishino
Osamu Kawamiya
Masahiro Ishino