Title:
自動ウェーハめっき装置
Document Type and Number:
Japanese Patent JP3583883
Kind Code:
B2
Abstract:
An automatic wafer plating equipment for automatically plating wafers and more particularly, for automatically plating a small lot of wafers is disclosed. The automatic wafer plating equipment includes a transfer robot provided with a holding arm for pivoting, vertical movement, extending and extracting, a load stage, an orientation stage, a plating stage, a recovery stage, and a cleaning stage. The transfer robot carries out a series of the following operations for plating process. The wafers are picked up one by one from a supply cassette loaded to the load stage. The wafer is then fed to the orientation stage. The wafer orientated at the orientation stage is conveyed to the plating stage. The plated wafer is transferred from the plating stage to the recovery stage. When residue of a plating liquid has been recovered at the recovery stage, the wafer is conveyed to the cleaning stage.
Inventors:
Kazuhiro Taniguchi
Application Number:
JP1118997A
Publication Date:
November 04, 2004
Filing Date:
January 24, 1997
Export Citation:
Assignee:
Japan Electro Plated Engineering Co., Ltd.
International Classes:
C25D7/12; C25D17/06; H01L21/00; H01L21/288; (IPC1-7): C25D17/06; C25D7/12; H01L21/288
Domestic Patent References:
| JP4293796A | ||||
| JP222499A |
Attorney, Agent or Firm:
Daisuke Tanaka