Title:
電子部品実装装置におけるパーツフィーダの装着構造
Document Type and Number:
Japanese Patent JP3596271
Kind Code:
B2
Inventors:
Hidehiro Saho
Application Number:
JP2575698A
Publication Date:
December 02, 2004
Filing Date:
February 06, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/02; (IPC1-7): H05K13/02
Domestic Patent References:
| JP9298388A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito