Title:
多層配線基板の製造方法
Document Type and Number:
Japanese Patent JP3610156
Kind Code:
B2
Inventors:
Kei Hayashi
Application Number:
JP7784896A
Publication Date:
January 12, 2005
Filing Date:
March 29, 1996
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/20; H01L23/12; H05K3/46; (IPC1-7): H05K3/46; H01L23/12; H05K3/20
Domestic Patent References:
| JP5315728A | ||||
| JP5304363A | ||||
| JP7330867A | ||||
| JP2230796A | ||||
| JP5198901A |