Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3623061
Kind Code:
B2
Inventors:
Takashi Murakami
Application Number:
JP33194096A
Publication Date:
February 23, 2005
Filing Date:
December 12, 1996
Export Citation:
Assignee:
Renesas Technology Corp.
International Classes:
H01L21/768; H01L21/265; H01L21/316; H01L23/522; (IPC1-7): H01L21/768; H01L21/265; H01L21/316
Domestic Patent References:
| JP4073964A | ||||
| JP2151032A | ||||
| JP5283542A | ||||
| JP2206120A | ||||
| JP8046035A | ||||
| JP8083839A | ||||
| JP8511653A | ||||
| JP3156929A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai