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Title:
モジュラコンベヤチェーン用熱可塑性チェーンリンク
Document Type and Number:
Japanese Patent JP3666740
Kind Code:
B2
Abstract:
The present invention is an improved modular chain link used for constructing a modular conveyor chain. The chain link includes a plastic body having a plurality of spaced link ends which are adapted to intermesh with complementary link ends projecting from a link or links in an adjacent row. The link ends include axially aligned openings that are adapted to receive a connecting pin. The connecting pin extends through the openings in the link ends of the intermeshing links and fastens the adjacent links together such that the links can pivot with respect to each other. The improved modular chain link further includes a support member that is molded within the plastic body of the chain link. The support member increases the strength of the modular chain link and minimizes the thermal expansion and contraction that occurs when the chain link is subjected to a temperature change.

Inventors:
Steveniki, James Sea.
Application Number:
JP2000607899A
Publication Date:
June 29, 2005
Filing Date:
March 24, 2000
Export Citation:
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Assignee:
Rexnode Corporation
International Classes:
B65G17/08; B65G17/40; (IPC1-7): B65G17/08; B65G17/40
Domestic Patent References:
JP59138513A
Attorney, Agent or Firm:
Takao Kawasaki