Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3687652
Kind Code:
B2
Inventors:
Toru Hinomura
Application Number:
JP2003018746A
Publication Date:
August 24, 2005
Filing Date:
January 28, 2003
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/28; H01L21/768; (IPC1-7): H01L21/768; H01L21/28
Domestic Patent References:
| JP10163126A | ||||
| JP6204170A | ||||
| JP8306781A |
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito
Tomoyasu Sakaguchi
Hiroki Naito