Title:
固体撮像装置
Document Type and Number:
Japanese Patent JP3689180
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To surely prevent the penetration of water causing a poor connection or disturbing the pickup image. SOLUTION: The sealing resin 9a is to cover the end edge adhered to an imaging surface 3. The water diffusion distance L of the resin 9a is obtained according to the Fick's diffusion law as a function of the temp. and humidity of an aqueous environment to which the solid state pickup device is exposed, and aqueous environment residence time of this device. The resin width H covering the exposed surface of the resin and adhered end edge 2a is set to a value greater than the distance L to ensure the water proofness.
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Inventors:
Takayuki Yoshida
Takanao Suzuki
Takanao Suzuki
Application Number:
JP15536096A
Publication Date:
August 31, 2005
Filing Date:
June 17, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/60; H01L23/02; H01L23/28; H01L27/14; H04N5/335; (IPC1-7): H01L27/14; H01L23/02; H01L23/28; H04N5/335
Domestic Patent References:
| JP5110960A | ||||
| JP2026080A | ||||
| JP6204442A | ||||
| JP63288050A |
Attorney, Agent or Firm:
Kazuhide Okada