Title:
積層セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP3780798
Kind Code:
B2
Inventors:
Tetsuhiko Ota
Hiroyuki Hori
Hiroyuki Hori
Application Number:
JP2000021904A
Publication Date:
May 31, 2006
Filing Date:
January 31, 2000
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C04B35/00; C04B35/622; C04B35/495; H01G4/12; H01G4/30
Domestic Patent References:
| JP8259334A |
Attorney, Agent or Firm:
Hitoshi Nishizawa