Title:
i線対応高解像感光性樹脂組成物およびパターン形成方法
Document Type and Number:
Japanese Patent JP3842736
Kind Code:
B2
Abstract:
A radiation sensitive resin composition for i-line light exposure comprising an alkaline soluble resin and a quinonediazide group-containing photosensitizer where said alkaline soluble resin comprises a novolak resin and a mixture of one or two or more of resins selected from the group of (i) polyacrylate, (ii) polymethacrylate, (iii) a polystyrene derivative and (iv) a copolymer consisting of two or more of monomer units selected from the group of acrylic ester, methacrylic ester and styrene derivatives is applied on a substrate such as a substrate for a flat panel display and exposed preferably at the light-exposure quantity of 50 to 500 mJ/cm<2> by an i-line light exposure source to form a pattern with high-resolution and a good pattern shape having no tailing.
Inventors:
Shuichi Takahashi
Application Number:
JP2002550442A
Publication Date:
November 08, 2006
Filing Date:
December 11, 2001
Export Citation:
Assignee:
az Electronic Materials Co., Ltd.
International Classes:
G03F7/023; G03F7/004; G03F7/022; G03F7/09
Domestic Patent References:
| JP6194835A | ||||
| JP6194827A | ||||
| JP58122533A | ||||
| JP55129341A | ||||
| JP10207057A | ||||
| JP2000258901A | ||||
| JP11231518A | ||||
| JP10142784A | ||||
| JP10020503A |
Attorney, Agent or Firm:
Hiroki Kaneo
Takeo Noguchi
Takeo Noguchi