Title:
ドライエッチング方法
Document Type and Number:
Japanese Patent JP3879014
Kind Code:
B2
Abstract:
A metallic thin film of copper, silver, gold, or one alloy selected from alloys containing as a main component at least one of these metals is etched by plasma of an etching gas containing at least nitrogen oxide while being reacted with the plasma, whereby making it possible to fine-process electrically conductive materials, heat-transfer materials and electric-contact materials made of copper, silver, gold or an alloy containing as a main component at least one of these metals.
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Inventors:
Isao Nakatani
Application Number:
JP2000585923A
Publication Date:
February 07, 2007
Filing Date:
December 02, 1999
Export Citation:
Assignee:
National Institute for Materials Science
Japan Science and Technology Agency
Japan Science and Technology Agency
International Classes:
H01L21/3065; C23F4/00; H01L21/033; H01L21/3213; H01L21/768
Domestic Patent References:
| JPH1068094A | 1998-03-10 | |||
| JPS6265331A | 1987-03-24 | |||
| JPS6312138A | 1988-01-19 | |||
| JPH03295232A | 1991-12-26 |
Attorney, Agent or Firm:
Toshio Nishizawa