Title:
複数の中空キャップを使用する方法
Document Type and Number:
Japanese Patent JP3962687
Kind Code:
B2
Abstract:
A method of using protective caps ( 160 ) applied to a first side of a wafer ( 150 ) in the production of microfabricated devices ( 152 ), such as micro-electro-mechanical systems (MEMS) devices. One cap ( 160 ) covers each microfabricated device or group respectively, such that a gap remains between adjacent protective caps. One or more etches are applied to the gaps between the caps to remove material and separate the wafer into separate units.
Inventors:
Silverbrook, Kaia
Application Number:
JP2002556934A
Publication Date:
August 22, 2007
Filing Date:
January 08, 2002
Export Citation:
Assignee:
Silverbrook Research Pty Limited
International Classes:
H01L21/301; H01L23/02; B29C43/36; B81B7/00; B81C1/00; H01L21/48; H01L23/04; B29C35/08
Domestic Patent References:
| JP2000340526A | ||||
| JP2000031349A | ||||
| JP4130647A | ||||
| JP9181019A |
Attorney, Agent or Firm:
Yuichi Yamada
Yasuhito Suzuki
Yasuhito Suzuki