Title:
基板の貼り合せ方法および基板の貼り合せ装置
Document Type and Number:
Japanese Patent JP3973903
Kind Code:
B2
Inventors:
Hideki Yamazaki
Shingo Tamai
Shingo Tamai
Application Number:
JP2001401764A
Publication Date:
September 12, 2007
Filing Date:
November 24, 2001
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
G02F1/13; B05C5/00; B05C11/10; B05D1/26; B05D3/00; B05D7/00; G02F1/1333
Domestic Patent References:
| JP10333157A | ||||
| JP2001281678A | ||||
| JP10052664A | ||||
| JP2001242473A | ||||
| JP5265011A | ||||
| JP2000246887A | ||||
| JP8094984A |