Title:
半導体ウエーハの製造方法および半導体ウエーハ製造の受注方法ならびに半導体ウエーハ製造の受注システム
Document Type and Number:
Japanese Patent JP3982270
Kind Code:
B2
Abstract:
The present invention provides a method for manufacturing a semiconductor wafer comprising steps of obtaining information of a device manufacturing process, selecting a wafer manufacturing process corresponding thereto, and manufacturing a semiconductor wafer according to the selected wafer manufacturing process. The present invention also provides a method for receiving an order for manufacture of a semiconductor wafer comprising a step of connecting a device maker with a customer computer in a wafer maker, a step wherein the customer computer receives information of a device manufacturing process and a step of selecting a wafer manufacturing process corresponding thereto, and provides a system for receiving an order for manufacture of a semiconductor wafer comprising a client terminal in a device maker and a customer computer in a wafer maker wherein information of a device manufacturing process is inputted into the client terminal and is sent, the customer computer receives the information of the device manufacturing process, and a wafer manufacturing process corresponding thereto is selected. Thereby, there can be provided a method for manufacturing a semiconductor wafer, a method for receiving an order for manufacture of a semiconductor wafer, and a system for receiving an order wherein a wafer suitable for a device manufacturing process in a device maker is supplied.
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Inventors:
Tatsuo Ito
Shigeyoshi Narazu
Masashi Ichikawa
Nobuhiro Ohara
Shigeyoshi Narazu
Masashi Ichikawa
Nobuhiro Ohara
Application Number:
JP2002019334A
Publication Date:
September 26, 2007
Filing Date:
January 29, 2002
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/02; G05B19/418; G06Q10/00; G06Q50/00; G06Q50/04
Domestic Patent References:
| JP2002024634A | ||||
| JP11345750A | ||||
| JP4073925A |
Attorney, Agent or Firm:
Mikio Yoshimiya