Title:
半導体製造装置
Document Type and Number:
Japanese Patent JP3988948
Kind Code:
B2
Abstract:
A holder body hides the back side of a semiconductor wafer (100) during a process in the reaction tube (1), the body having a wafer lifter with a portion that can be disengaged from and coupled to the body so that the lower portion of the wafer is supported by a dual boat (9) and to lift the wafer from the wafer body when the wafer is loaded or unloaded. A separation boundary between the holder body and the wafer lifter has a gas inflow interception surface to hinder reaction gas from flowing through the boundary. An independent claim is also included for a semiconductor manufacturing system.
Inventors:
Lee Shin-ichi
Application Number:
JP2004145449A
Publication Date:
October 10, 2007
Filing Date:
May 14, 2004
Export Citation:
Assignee:
TERASEMICON CORPORATION
International Classes:
C23C16/44; H01L21/683; B65G65/04; H01L21/205; H01L21/673; H01L21/68
Domestic Patent References:
| JP10070081A | ||||
| JP4137646A | ||||
| JP2003100648A | ||||
| JP2004179600A | ||||
| JP2003209153A |
Attorney, Agent or Firm:
Kyosei International Patent Office