半導体装置の製造方法およびそれに使用されるボンディング装置

Title:

半導体装置の製造方法およびそれに使用されるボンディング装置

Document Type and Number:

Japanese Patent JP3995559

Kind Code:

B2

Abstract:

To provide a process for producing a semiconductor device in which chips of different sizes are bonded to one wiring board.

The bonder 30 comprises a θ-axis robot 75 for reversing a pickup head 77 picking up a chip, a bonding head 55 for bonding a chip delivered from the pickup head 77 to a wiring board 20, and an image recognizer 79 for recognizing the position of the chip when the bonding head 55 receives the chip from the pickup head. The bonding head 55 receives the chip from the pickup head 77 while shifting it from the center based on the recognition results from the image recognizer 79 and then bonds the chip to the wiring board 20 such that it does not interfere with a previously bonded chip. Since chips of different sizes can be bonded to one wiring board without changing the bonding head, production cost and time of an MCM can be reduced.

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Inventors:

Koji Katsuta
Obata Osamu

Application Number:

JP2002242455A

Publication Date:

October 24, 2007

Filing Date:

August 22, 2002

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