Title:
半導体素子の半田付け方法
Document Type and Number:
Japanese Patent JP3997927
Kind Code:
B2
Inventors:
Shinzo Yamashita
Application Number:
JP2003045819A
Publication Date:
October 24, 2007
Filing Date:
February 24, 2003
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B23K1/08; H01L23/50; H01L21/50; H01L25/00; H05K13/00; B23K101/40
Domestic Patent References:
| JP8279592A |
Attorney, Agent or Firm:
Shogo Takahashi
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka
Tadahiko Inaba
Kanako Murakami
Nakatsuru Kazutaka