Title:
半導体レーザ装置及びその製造方法
Document Type and Number:
Japanese Patent JP4010679
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a small semiconductor laser having good radiating characteristics for increasing positioning accuracy, when the laser system is installed in an optical device like an optical pick-up. SOLUTION: In the semiconductor laser 1, a protective frame 3 is provided at the top end of a flat substrate 2, and a semiconductor laser element 4 and a photodetector 5 for detecting the output are mounted on a front face of the substrate 2 surrounded by the protective frame 3. The protective frame 3 made of light shielding resin is fitted by a fitting means and located at an inner position at a given distance from a front edge 21a and right and left side edges 21b and 21c on the substrate 2. In the fitting means, a hole is provided in the substrate 2, and a small protrusion to be inserted in the hole is formed in the protective frame 3.
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Inventors:
Norio Isshiki
Application Number:
JP34051998A
Publication Date:
November 21, 2007
Filing Date:
November 30, 1998
Export Citation:
Assignee:
Sanyo Electric Co., Ltd.
Tottori Sanyo Electric Co.,Ltd.
Tottori Sanyo Electric Co.,Ltd.
International Classes:
H01S5/00; H01S5/022
Domestic Patent References:
| JP2054263U | ||||
| JP2163985A | ||||
| JP2125687A |
Attorney, Agent or Firm:
Hiroshi Kakutani