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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4015790
Kind Code:
B2
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Inventors:
Yoshifumi Nakamura
Ryuichi Sahara
Noriyuki Kaino
Nozomi Shimoishizaka
Takahiro Kumakawa
Application Number:
JP29905899A
Publication Date:
November 28, 2007
Filing Date:
October 21, 1999
Export Citation:
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Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/12; H01L21/60
Domestic Patent References:
JP11274155A
JP11251353A
JP59084529A
Foreign References:
WO1998032170A1
Attorney, Agent or Firm:
Hiroshi Maeda
Hiroshi Koyama



 
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