Title:
半導体チップ、半導体装置及びその製造方法、並びに電子機器
Document Type and Number:
Japanese Patent JP4020097
Kind Code:
B2
Abstract:
A semiconductor chip is provided that is highly packageable and particularly well suited for mounting on a circuit board having a curved surface. The semiconductor chip comprises a warpage control film that controls the warpage of a substrate.
Inventors:
Harumi Kazumi
Application Number:
JP2004141215A
Publication Date:
December 12, 2007
Filing Date:
May 11, 2004
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L23/29; H01L23/00; H01L23/02; H01L23/31; H01L29/06; H05K1/02
Domestic Patent References:
| JP10270607A | ||||
| JP5129304A | ||||
| JP8153823A | ||||
| JP63004653A | ||||
| JP2000243754A | ||||
| JP2004079928A | ||||
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Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Masakazu Aoyama
Masatake Shiga
Masakazu Aoyama