Title:
半導体装置の製造方法及び半導体装置
Document Type and Number:
Japanese Patent JP4022113
Kind Code:
B2
Inventors:
Kazuhiko Ito
Kyosuke Endo
Kyosuke Endo
Application Number:
JP2002249156A
Publication Date:
December 12, 2007
Filing Date:
August 28, 2002
Export Citation:
Assignee:
Shindengen Industry Co., Ltd.
International Classes:
H01L21/304; H01L21/329; H01L21/336; H01L29/78; H01L29/861
Domestic Patent References:
| JP11297980A | ||||
| JP10294474A | ||||
| JP6163875A | ||||
| JP6112312A | ||||
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| JP2000030558A | ||||
| JP11066552A | ||||
| JP10242203A | ||||
| JP10116828A | ||||
| JP57045276A | ||||
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| JP1232719A | ||||
| JP10012897A |
Foreign References:
| WO1998012755A1 |
Attorney, Agent or Firm:
Seigo Matsuo
Kenji Emori
Kenji Emori