Title:
可撓性フィルム電気回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP4023835
Kind Code:
B2
Inventors:
Uehara Hideo
Takaaki Furuta
Takaaki Furuta
Application Number:
JP7794494A
Publication Date:
December 19, 2007
Filing Date:
March 23, 1994
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
Ray Tech Co., Ltd.
Ray Tech Co., Ltd.
International Classes:
H05K1/11; H05K3/28; H05K1/03; H05K1/00; H05K3/40
Domestic Patent References:
| JP60137096A | ||||
| JP218987A | ||||
| JP612338A | ||||
| JP4165358A | ||||
| JP519473A | ||||
| JP639190A | ||||
| JP1253992A | ||||
| JP5102632A | ||||
| JP412679U |