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Title:
電子部品用ケース
Document Type and Number:
Japanese Patent JP4030427
Kind Code:
B2
Abstract:
A case for electronic components comprises a metallic case and an electrically insulating exterior coating of an epoxy resin-based powder coating material comprising an epoxy resin, a phenolic curing agent, preferably poly(bisphenol A-hydroxypropyl ether) or poly(bisphenol F-2-hydroxypropyl ether) and a curing promoter, where the powder coating material applied to the metallic case as an electrically insulating exterior coating has distinguished coating film flexibility and adhesion to the metallic case without any cracking or peeling in the step to form an obturating portion of the open end of the metallic case and can be cured at a relatively low curing time for a relatively short time.

Inventors:
Naoki Matsubara
Dai Sato
Koichi Ohno
Kazuhisa Senda
Kiyofumi Fukasawa
Hayashi Mitsuhiko
Yokoichi Koichi
Application Number:
JP2002521377A
Publication Date:
January 09, 2008
Filing Date:
August 23, 2001
Export Citation:
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Assignee:
NOK CORPORATION
Pernox Co., Ltd.
Kanto NOK Sales Co., Ltd.
International Classes:
B05D7/14; B05D7/24; H01G9/08; H01M50/119; H01M50/121; H01M50/124; H01M50/133; H05K5/02
Domestic Patent References:
JP2000109751A
JP2000109728A
JP10017793A
JP5320537A
JP4338624A
JP11149908A
JP7037573A
Attorney, Agent or Firm:
Toshio Yoshida
Kazuko Yoshida