Title:
多層配線構造体及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4034482
Kind Code:
B2
Inventors:
Masaki Yamada
Application Number:
JP26422299A
Publication Date:
January 16, 2008
Filing Date:
September 17, 1999
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L21/768; H01L21/3205; H01L23/52
Domestic Patent References:
| JP2000068273A | ||||
| JP11121413A | ||||
| JP2001077113A |
Attorney, Agent or Firm:
Toshi Takemura