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Title:
基板の処理装置
Document Type and Number:
Japanese Patent JP4047635
Kind Code:
B2
Abstract:

To provide an apparatus for treating a substrate which supplies the substrate with a treating liquid that is prepared by diluting an adding fluid with a diluting fluid without using a mixing tank.

In the treating apparatus in which the substrate is treated with the treating liquid sprayed from the nozzle, there are provided a nozzle main body, a mixing chamber 68 installed in the nozzle main body, a spraying part 69 communicating with the mixing chamber, a first connected hole 65, installed in the nozzle, for supplying the diluting fluid to the mixing chamber, a second connected hole 66, installed in the nozzle, for supplying the adding fluid to be diluted with the diluting fluid, and a third connecting hole 67, installed in the nozzle, for supplying a pressurized gas from the spraying part for pressurizing and spraying the treating liquid prepared by dilution of the adding fluid with the diluting fluid in the mixing chamber.

COPYRIGHT: (C)2004,JPO


Inventors:
Yukinobu Western
Akinori Iso
Application Number:
JP2002173209A
Publication Date:
February 13, 2008
Filing Date:
June 13, 2002
Export Citation:
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Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
B05B7/04; B08B3/02; B05B1/00; H01L21/027; H01L21/304
Domestic Patent References:
JP10235234A
JP61131459A
JP2002079192A
JP62201665A
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai