Title:
電子部品装着装置および電子部品装着方法
Document Type and Number:
Japanese Patent JP4048087
Kind Code:
B2
Inventors:
Tadatomo Suga
Toshihiro Ito
Kazushi Higashi
Takahiro Yonezawa
Shinzo Eguchi
Yoshihisa Oido
Kazuyuki Tomita
Toshihiro Ito
Kazushi Higashi
Takahiro Yonezawa
Shinzo Eguchi
Yoshihisa Oido
Kazuyuki Tomita
Application Number:
JP2002223493A
Publication Date:
February 13, 2008
Filing Date:
July 31, 2002
Export Citation:
Assignee:
Tadatomo Suga
Toshihiro Ito
Matsushita Electric Industrial Co., Ltd
Toshihiro Ito
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/52; H05K13/04; H01L21/60
Domestic Patent References:
| JP2002076586A | ||||
| JP2002064268A | ||||
| JP7122525A | ||||
| JP2003007970A | ||||
| JP2003318220A | ||||
| JP2003318223A | ||||
| JP61231734A |
Attorney, Agent or Firm:
Aoyama Aoi
Mitsuo Wada
Mitsuo Wada