Title:
半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP4049095
Kind Code:
B2
Inventors:
Saichiro Kaneko
Masakatsu Hoshi
Tetsuya Hayashi
Hideaki Tanaka
Masakatsu Hoshi
Tetsuya Hayashi
Hideaki Tanaka
Application Number:
JP2003430203A
Publication Date:
February 20, 2008
Filing Date:
December 25, 2003
Export Citation:
Assignee:
Nissan Motor Co., Ltd
International Classes:
H01L29/78; H01L21/336; H01L29/12
Domestic Patent References:
| JP2002280554A | ||||
| JP11238742A | ||||
| JP11274487A |
Attorney, Agent or Firm:
Yoshihiko Izumi
Shigeru Kobayashi
Shigeru Kobayashi