Title:
複合材及び接着剤用途の熱硬化性重合体
Document Type and Number:
Japanese Patent JP4054062
Kind Code:
B2
Abstract:
Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
Inventors:
Void, jack
Quo, Albert
Quo, Albert
Application Number:
JP51888797A
Publication Date:
February 27, 2008
Filing Date:
October 30, 1996
Export Citation:
Assignee:
Psytech Technology Corporation
International Classes:
C08F222/40; C08F22/40; C08J3/02; C08F212/34; C08G73/12; C08J5/24; C08L79/04; C09J135/00; C09J179/04
Domestic Patent References:
| JP2064113A | ||||
| JP62201916A | ||||
| JP2099508A |
Attorney, Agent or Firm:
Heikichi Odashima
Heigo Odashima
Heigo Odashima
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