Title:
硬化型イミド樹脂の製造法
Document Type and Number:
Japanese Patent JP4055729
Kind Code:
B2
Abstract:
To provide active energy ray-curable resins having improved heat resistance and electric characteristics, and to provide a method for producing a new curable imide resin soluble in a solvent, having increased photocurable properties and easily producible.
The method for producing the curable imide resin comprises reacting (a) a tetracarboxylic acid dianhydride represented by formula (1) (wherein, Ar is an organic group containing an aromatic ring), (b) a compound having at least one (meth)acryloyl group and hydroxy group with (c) a compound having at least two isocyanate groups.
COPYRIGHT: (C)2004,JPO&NCIPI
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Inventors:
Eiju Ichinose
Yozo Yamashina
Hideo Kunitomo
Hidenobu Ishikawa
Yozo Yamashina
Hideo Kunitomo
Hidenobu Ishikawa
Application Number:
JP2004086682A
Publication Date:
March 05, 2008
Filing Date:
March 24, 2004
Export Citation:
Assignee:
Dainippon Ink and Chemicals Co., Ltd.
International Classes:
C08F299/02; C08G18/34; C08G18/83; C08G18/67; C08G73/10
Domestic Patent References:
| JP7300459A | ||||
| JP59080428A |
Attorney, Agent or Firm:
Kono Tsuyo