Title:
フリップチップボンダー
Document Type and Number:
Japanese Patent JP4057457
Kind Code:
B2
Abstract:
A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a chuck table, a semiconductor chip take-out area and an electrode cutting area, a cutting mechanism having a cutting tool for cutting the plurality of electrodes projecting from the front surface of the semiconductor chip held on the chuck table and arranged in the electrode cutting area to make them uniform in height, a semiconductor chip take-in mechanism, and a semiconductor chip conveying mechanism.
Inventors:
Kazuhisa Arai
Shun Mori
Hideyuki Yamado
Shinichi Namioka
Shun Mori
Hideyuki Yamado
Shinichi Namioka
Application Number:
JP2003110538A
Publication Date:
March 05, 2008
Filing Date:
April 15, 2003
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/60; B23K20/00
Domestic Patent References:
| JP2004319698A | ||||
| JP2000173954A | ||||
| JP2001116796A | ||||
| JP2004319697A |
Foreign References:
| WO2004061935A1 |
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki
Sachiko Okunuki