Title:
電子部品
Document Type and Number:
Japanese Patent JP4060360
Kind Code:
B2
Abstract:
The SAW component has electrical structures which are encapsulated and sealed against environmental influences by a cap cover. Connecting pads of the electrical structures are exposed in a window of the cap cover and the pads are provided with a metallization. Solderable metallized areas are formed on the cap cover, and they are connected to the pad metallizations via through-plated holes.
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Inventors:
Pearl, Wolfgang
Sterutsuru, Alois
Kruger, Hans
Sterutsuru, Alois
Kruger, Hans
Application Number:
JP52321197A
Publication Date:
March 12, 2008
Filing Date:
December 16, 1996
Export Citation:
Assignee:
SIEMENS MATSUSHITA COMPONENTS GESELLSCHAFT MIT BESCHRANKTER HAFTUNG & COMPANY KOMMANDITGESELLSCHAFT
International Classes:
H03H9/145; H03H9/05; H03H9/10
Domestic Patent References:
| JP1213018A | ||||
| JP6029769A | ||||
| JP7111438A | ||||
| JP11502974A | ||||
| JP8316644A | ||||
| JP8213874A | ||||
| JP8078856A | ||||
| JP7221590A | ||||
| JP7086867A | ||||
| JP4293311A | ||||
| JP4293310A | ||||
| JP58139513A | ||||
| JP58139511A |
Attorney, Agent or Firm:
Iwao Yamaguchi