Title:
導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
Document Type and Number:
Japanese Patent JP4068883
Kind Code:
B2
Abstract:
A first liquid including a first metal particle is disposed on the base board (11) via a liquid ejecting section (10) so as to form a conductive layer wiring (W2) having a predetermined pattern on a base board (11). A surface of the base board (11) is treated so as to be liquid-repellent. A second liquid which is different from a first liquid is disposed on the base board (11) by a liquid ejecting section (10) in advance. Thus, an interlayer (W1) which can improve an adhesion between the base board (11) and the conductive layer wiring (W2) is formed. By doing this, a method for forming a conductive layer wiring for realizing a finer width in the conductive layer wiring and enhancing an adhesion between the base board and the conductive layer wiring can be provided.
Inventors:
Masahiro Furusawa
Toshimitsu Hirai
Masaaki Oda
Iwashige
Toshimitsu Hirai
Masaaki Oda
Iwashige
Application Number:
JP2002119448A
Publication Date:
March 26, 2008
Filing Date:
April 22, 2002
Export Citation:
Assignee:
Seiko Epson Corporation
ULVAC, Inc.
ULVAC, Inc.
International Classes:
G02F1/1343; G02F1/1345; H01J9/02; H05K3/12; G02F1/1362; H01L51/40
Domestic Patent References:
| JP11274671A | ||||
| JP11204529A | ||||
| JP2001284798A | ||||
| JP11207959A |
Attorney, Agent or Firm:
Takashi Watanabe
Masatake Shiga
Shinya Mitsuhiro
Masatake Shiga
Shinya Mitsuhiro