はんだ用BTA誘導体、それを用いたはんだ、それを用いたフラックス、それを用いたはんだペースト

Title:

はんだ用BTA誘導体、それを用いたはんだ、それを用いたフラックス、それを用いたはんだペースト

Document Type and Number:

Japanese Patent JP4068973

Kind Code:

B2

Abstract:

To hardly cause an oxide film on the surface of Pb-free soluble alloy.

The BTA (benzotriazole) derivative for solder is expressed by general formula (1) and general formula (2), and the molecular weight of Y is ≥ 2 and ≤ 200, where, in general formulae (1) and (2), X1 and X2 denote H or CH3, Y denotes a substituent consisting of C, H, O, N, S, P, a halogen element, an alkali earth element or a heavy metal element.

Inventors:

Masahiro Sugiura
Akizuki Makoto
Naoyuki Fujii
Tadashi Fukuzuka

Application Number:

JP2003004936A

Publication Date:

March 26, 2008

Filing Date:

January 10, 2003

Export Citation:

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Assignee:

Solder Court Co., Ltd.
Enex Co., Ltd.

International Classes:

B23K35/363; B23K35/26; C07D249/18; C07D487/04; C22C13/00; H05K3/34

Domestic Patent References:

JP3238195A
JP6246481A
JP2000015477A

Foreign References:

WO2001080611A1

Attorney, Agent or Firm:

Tomoaki Higashiguchi
Hiroshi Okawa

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