Title:
セラミックス回路基板
Document Type and Number:
Japanese Patent JP4077888
Kind Code:
B2
Abstract:
A ceramic circuit board is characterized by being constituted by bonding a ceramic substrate 2 and a metal circuit plate 3 to each other through a silver-copper-based brazing material layer 5 containing at least one active metal selected from Ti, Zr, Hf, V, Nb and Ta, and wherein the Vickers hardness of a reaction product layer 6 generated by causing the silver-copper-based brazing material layer 5 and the ceramic substrate 2 to react with each other is 1,100 or more. At least one element selected from In, Zn, Cd, and Sn is preferably contained in the silver-copper-based brazing material layer 5. Further, 0.1 to 10.0 wt% of carbon powder is preferably contained in the brazing material layer 5. According to the above arrangement, there can be provided a ceramic circuit board in which cracks are effectively suppressed from being formed even after a thermal cycle is repeatedly applied for a long period of time, i.e., a ceramic circuit board having so-called excellent heat-cycle resistance characteristics and high reliability.
Inventors:
Takayuki Nawa
Application Number:
JP18584295A
Publication Date:
April 23, 2008
Filing Date:
July 21, 1995
Export Citation:
Assignee:
Toshiba Corporation
Toshiba Materials Co., Ltd.
Toshiba Materials Co., Ltd.
International Classes:
H05K1/09; B23K1/00; H05K3/38; B23K35/14; B23K35/30; C04B37/02; H01L23/14; H01L23/15; H01L23/373; H05K3/20
Domestic Patent References:
| JP4290462A | ||||
| JP6329480A | ||||
| JP597532A | ||||
| JP782050A |
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Takehiko Yamada
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Takehiko Yamada